Technical Date Sheet
PRODUCT HM-28D
 耐高温及阻燃的电子热熔胶
 Hot Melt Adhesine for Electron parts bond, High Heating Resistance and Flame Retardant
用途：适用于热熔胶枪，用于需求耐高温和阻燃的电子器材部件和线圈等。
Application：Suitable for Hot Melt Glue Gun, Used In Electron parts or coi.l、Etc。

主要成分COMPOSITION:                        PP                                  

固体含量SOLID CONTENT:                       100%

软 化 点R&B SOFTENING POINT：              140℃±10℃
                                        
布氏粘度BROOKFIELD VISCOSITY：             180℃……………………15000±1500mpas

规格DIMENSION OF THE GRADE：               11.3±0.3 Χ300mm                                

固化时间SETTING TIME:                           6-10sec

外观Appearance:                                  白色棒状  White Glue Stick
                                   
特  性：         无毒、符合环保要求。耐高温紫外线，阻燃，粘合力强。
Specific Properties: Non-toxic, passed “SGS” safety, And Environmental . Heat—Resistance, Resistance to Degradation caused by UV light flame—Retardant.
good Adhesion force

使用说明Use introdution:：              建议参考使用 Suggest operating
                                      使用80--120W热熔胶枪Use 80--120W Hot Melt Glue Gun

储 存:  存放于阴凉、通风干燥处，可储存12个月。                                
STORAGE: Stored in the cool and dry ventilated places. Storage life 12 month.

包  装：  纸箱
Package: paper box.

注意事项：被粘的电子器件要干净：受潮或有杂质会影响粘接效果。
Notice: Electron parts must clean. Result from Wet and Impurity, The Adhesion force shall be down.

此资料仅供参考，我们郑重建议使用者进行详尽的试验以确定**终使用参数。