产品特性Features

1、 特点 Feature

1.1**的封装工艺，封装材料满足UL94-V0

Advanced packaging technology, packaging materials meet UL94-V0

1.2结构紧凑，体积小，节省空间

Compact structure, small size, space saving

1.3优越的高温高湿性能

Superior high temperature and high humidity performance

1.4强大的耐电压能力

Strong ability to suppress high surge and high current

1.5 SMD料盘包装，适用于无铅回流焊/波峰焊自动贴装

SMD tray packaging, suitable for lead-free reflow soldering/wave soldering automatic placement

1.6符合RoSH ，REACH ，H.F无卤

Comply with RoSH, REACH，H.F 

1.7安规认证：Safety certification:

1.8管理体系认证：

ISO9001:2015质量管理体系 ISO9001:2015 Quality Management System

ISO14001:2015环境管理体系ISO14001:2015 Environmental Management System

IAFT16949:2016汽车行业质量管理体系IAFT16949:2016 Automotive Quality Management System

2、应用 Application

2.1 LED circuit protectionLED电路保护

2.2 Industrial equipment工业设备

2.3 Communication equipment通讯设备

2.4 Automotive Electronics汽车电子

■测试条件  Test Condition

工作温度:-40℃~125℃    储存温度: -10℃~40℃